Ultra-high precision printing technology

Technical Advantages

Precision multi-axis electronic additive manufacturing equipment and control systems

microfluidic printhead structural design and arrayed direct-write printing technology

functional electronic additive materials suitable for mass production

Excellent material adaptability with broad selection range

supports arrayed, wide-format printing modules

highly flexible colloidal shaping control capabilities

enables multi-material printing of points, lines, surfaces, and 3D structures

integrates multiple printing modes

Parameter Comparison

Inkjet Printing
Aerosol Jet
Printing Precision
>50 μm
~10 μm
3D Processing
Layer-by-layer stacking
Non-self-supporting curved surfaces
Multi-material integration
Low
Low
Printing Speed
Medium
Low
Printing Cost
Medium
High
Substrate Structure Compatibility
Planar
3D structures
Chip Integration Capability
Low
Low
Scenario Scalability
Low
Low

Multi-module printing processes for diverse application scenarios

Multi-head printing

Meets mass production demands, scalable to hundreds of concurrent print heads

Multi-material hybrid printing

Enables 3D composite processing of metals, dielectrics, and other functional materials

Embedded printing

Achieves self-supporting complex 3D structures

Five-axis printing

Adaptable to surface printing with complex 3D topological structures

Multi-process integration

Enables end-to-end workflow and full-line setup including laser processes, diverse printing methods, and inspection

Multi-head printing

Photonic sintering, in-situ sintering, etc.

Solutions

Ultrahigh Resolution Additive Manufacturing Solutions For Electronics

Ultra-Precision Circuit Printing

Micro/nano Direct Ink Writing(DIW)technology can achieve 1 μ m ultra precision circuit printing, and directly construct circuit patterns by extruding conductive nanoparticle ink through fine nozzles.

Array-based Multi-material Direct Ink Writing (mm-DIW)

Our self-developed material system's unique fluid dynamics enables precise direct ink writing of complex 3D structures. Simple heating or photocuring yields stable structures—an efficient,convenient solution.

Multi-Axis Coordinated Direct Ink Writing Technology

By using multi axis motion control and compensation algorithms, high-precision circuit processing of complex surfaces can be achieved, adapting to various shapes of substrates.

3D Printing of Complex Structures

Our self-developed material system enables precise, complex 3D structures via Direct Ink Writing (DIW). Rapid solidification with simple heating or UV curing provides an efficient, convenient 3D manufacturing solution.

Embedded Direct 3D Printing Technology

Our self-developed embedded direct-write 3D printing system uses support material assistance to precisely build complex metal and non-metal 3D structures. Optimized thermal curing and support removal enable 1–10 µm features for high-precision micro-nano manufacturing.

Multi-Layer Circuit Fabrication

Self-developed system combining direct ink writing & precision coating enables high-precision multilayer circuits. With drilling, laser punching, and printed via filling for interconnection — a one-stop HDI solution.