Combining micro-nano Direct Ink Writing (DIW) additive printing technology with proprietary nanoscale inks, this system delivers 3D printing at feature sizes of 1–10 μm.
This platform integrates a high-precision five-axis motion system with direct writing technology, enabling precise deposition of conductive, insulating, encapsulating, and other functional materials onto complex curved substrates.
Supports precise distribution of diverse inks/materials
Simplified tool path generation via direct CAD import
Available in simultaneous or 3+2 positional versions
Working area of 180 × 180 × 90 mm
Designed for R&D and prototyping applications
Utilizes pneumatic direct writing technology combined with a self-developed dispensing printhead module to achieve precision dispensing of epoxy, silicone, UV adhesives, and more.
Supports CAD pattern import for processing
Self-developed adjustable array dispensing module
Self-developed tilt-and-rotate dispensing module
Equipped with an in-situ UV curing module
Supports a maximum processing area of 12 inches
Direct Ink Writing (DIW) additive printing technology combined with micro-nano conductive metal pastes enables metallization of precision interconnect vias such as TSV, TGV, and TMV.
Environmentally friendly process (without electroplating)
Supports direct CAD drawing import for fully automated machining
Precision micro-holes support blind-hole filling
High-solid-content materials have high packing density
Filling materials can be cured at temperatures below 200℃
Utilizes micro‑nano Direct Ink Writing (DIW) additive printing technology combined with a self‑developed adjustable array multi‑printhead module to fabricate conductive 3D structures (vertical walls, pillars) for applications such as electromagnetic shielding of RF modules and interconnects in stacked packaging.
Supports standard carrier board and 12-inch wafer processing
Features adaptive process closed‑loop parameter tuning
Self-developed high three-dimensional forming performance conductive paste
Self-developed adjustable array parallel printing module
Filler material curing temperature below 200°C
Combines high-speed jetting technology with direct writing dispensing technology to achieve precise solder paste printing and micro-dispensing. The minimum jetting spot diameter can be as small as 250 μm, and the minimum dispensing diameter can be as small as 100 μm. Suitable for deep‑cavity packages, flexible substrates, and similar products.
Minimum solder paste jetting spot diameter down to 250 μm
Supports Gerber file import for automated processing
High motion acceleration ensures processing efficiency
Supports deep-cavity products of 6 mm and above
Compatible with a variety of solder pastes such as SAC305, SnPb, and more
Utilizes a self-developed fused direct writing valve to heat, melt, and pattern-print alloy solders such as InAg, SnBi, SAC305, and SnSb, suitable for MEMS and hermetic packaging solder bonding.
Supports wafer map file import
Supports melt printing of commonly used solders
Supports localized inert gas atmosphere for oxidation prevention
Typical printing feature size: 150 μm
Supports a maximum processing area of 8 inches
Supports multiple modes including line drawing and dot dispensing
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